a little Glossary
|BGA||Ball Grid Array||
Array of tiny balls in contact with some internal wiring of an electronics package.
Each ball is meant to swim in a certain amount of solder during the reflow process.
BGAs enable high PC / HD part-to-PCB connections with very low profile.
|CPU||Central Processing Unit||The central Part that runs the computer, often also referred to as µP.|
|HTML||Hyper Text Markup Language||
Innovative concept for retrieval of keywords in a single text,
and, beyond that, inter-networking in a lot of scientific texts originally.
Invented by Tim Berners-Lee of CERN at Geneva, Switzerland.
The very basis for the explosive success of the WWW on the internet.
|µP||Micro-Processor||Highly integrated circuit capable of processing data through executing code.|
Number of connections between a component and the PCB
must be high for VLSI components in high speed applications.
|PCB||Printed Circuitry Board||
Carrier for soldered-on components containing circuitry wiring.
May be single- or double-sided or of multilayer design.
Modern designs are of SMT type, components placed by robots
then reflow soldered to the PCBs pads.
|QFP||Quad Flat Pack||
A µchip in a quadratic or rectangular shaped housing
(mostly of plastic) with connections on either edge of it.
|SMT||Surface Mount Technology||
components which do not have wires to be solderd through PCB holes
but are soldered directly to the PCBs pads and kept in place solely by that.
|VLSI||Very large Scale Integration||
Millions of transistors on a chip the size of a fingernail
|WWW||World Wide Web||
You are looking at it right now.
To be continued...
(always under construction)